Heat dissipation in computing device

ABSTRACT

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/253,126, entitled “COMPUTER COMPONENT PROTECTION”, filed Oct. 16,2008, which is a is a continuation of U.S. patent application Ser. No.11/624,141, entitled “COMPUTER COMPONENT PROTECTION”, filed Jan. 17,2007, now U.S. Pat. No. 7,457,111, issued Nov. 25, 2008, which is adivisional of U.S. patent application Ser. No. 11/336,102, entitled“COMPUTER COMPONENT PROTECTION”, filed Jan. 19, 2006, now U.S. Pat. No.7,301,761, issued Nov. 27, 2007, which is a divisional of U.S. patentapplication Ser. No. 11/002,484, entitled “COMPUTER COMPONENTPROTECTION”, filed Dec. 1, 2004, now U.S. Pat. No. 7,019,967, issuedMar. 28, 2006, which is a divisional of U.S. patent application Ser. No.09/842,408, entitled “COMPUTER COMPONENT PROTECTION”, filed Apr. 24,2001, now U.S. Pat. No. 6,900,984, issued on May 31, 2005, which are allincorporated herein by reference.

BACKGROUND

The present invention relates generally to a computer device. Moreparticularly, the present invention relates to arrangements forprotecting key components of the computing device.

Portable computers generally consist of a lid for carrying a displayscreen and a base for carrying various internal and external componentsused for operating the portable computer. By way of example, theinternal components may be a hard drive, a modem, a processor, a diskdrive, memory and the like, and the external components may be akeyboard, a track pad, buttons and the like.

In recent years, sensitive components, such as CD/DVD drives and LCDdisplays, have been incorporated into the portable computer. Bysensitive, it is meant that the CD/DVD drives and LCD displays are someof the most fragile components of the portable computer in terms ofsensitivity to impact. The CD/DVD drive generally includes drivecomponents for reading a compact disc (CD) and/or a digital video disc(DVD) and transport components for inserting and removing the CD and DVDdiscs to and from the drive components. By way of example, the drivecomponents may include a laser, light sensing diode, and a spindlemotor, and the transport components may include a movable tray. The LCDdisplay, on the other hand, uses glass substrates with transparentelectrodes and a liquid crystal material placed in a gap between theelectrodes. The LCD also uses sophisticated driving circuitry (e.g.,integrated circuit) for energizing selected segments of the LCD tocreate the desired image.

Unfortunately, the manner in which the LCD and CD/DVD drive are mountedoffers little protection against damage, as for example, damage that isdue to dropping or other day-to-day handling of the portable computer.Each of these components is rigidly mounted in the base or lid and thusthey are susceptible to damage when the portable computer, and moreparticularly the base and lid, feels an impact. Conventionally, the LCDdisplay and the CD/DVD drive have been rigidly mounted to a structuralcomponent of the lid and base, respectively, via a fastener such as ascrew or bolt. As such, when a portable computer is dropped, the forceof impact is typically transferred from the base to the CD/DVD drive andfrom the lid to the LCD display through the fastening device. Further,as portable computers become smaller, their associated compactstructures have even less damage prevention capability. That is, thefragile LCD and CD/DVD drive are more vulnerable to damage as the sizeof the computer decreases.

The CD/DVD drive also includes an enclosure for housing the drive andtransport components. The enclosure is typically arranged tostructurally support the components, to shield electronic and laseremissions therein, and to prevent dust particles from reaching the drivecomponents. In most cases, the CD/DVD drive, including its ownenclosure, is installed into the base of the portable computer. By wayof example, the enclosure may be permanently installed in the base via afastener, or removably installed in the base via a mating structurebuilt into the base.

Unfortunately, the technique of installing the CD/DVD enclosure into thebase leads to redundant features. That is, the drive components aredisposed inside a double box, i.e., an enclosure inside an enclosure,and therefore they have double features that serve the same purpose, asfor example, structural support, shielding, dust protection, and thelike. While double protection may sound good, the double box tends toadd unnecessary mass, volume, and expense to the portable computer.These are undesirable traits that go against the current trend to makethe portable computer cheaper, thinner and lighter. The extra layer ofmaterial may also inhibit the dissipation of heat from the drivecomponents, which can be a major source of heat in the portablecomputer. As should be appreciated, too much heat can lead to failuresin the operation of the CD/DVD drive.

As is generally well known, the CD/DVD drive is not the only source ofheat inside the base. Processor chips and other electronic components ofthe personal computers also generate significant amounts of heat inoperation. Advances in processor speed and bus throughput have furthercompounded this problem. As such, the portable computer generallyincludes a system for transferring heat away from these various chipsand electronic components. By way of example, a fan may be provided tothermally manage the internal components by forcing air through thebase. Individual components, such as the processor chip, can also have aheat sink attached thereto for dissipating heat generated by thecomponent. A heat sink is generally made of metal and includes aplurality of outward-extending fins. The metal fins are generallyconfigured to remove heat from the processor chip by means ofconduction, convection and radiation. In some cases, the processor chipmay be cooled by a fan and heat sink combination.

While fans and heat sinks provide effective mechanisms for thermallymanaging many types of computer systems, the fan typically generatesundesirable noise and requires an undesirable amount of power. Excessamounts of noise generally lead to user dissatisfaction, and excessamounts of power unduly draw upon the batteries of a portable computermaking it unattractive for long periods of battery-operated use. Asshould be appreciated, larger fans that provide the greatest amount ofcooling tend to produce a greater amount of noise, and use a greateramount of power.

In many instances it would be desirable to provide portable computersthat are cost effective, thinner, lighter, stronger and aestheticallymore pleasing than current portable computers. It would also bedesirable to provide impact shock protection for sensitive componentssuch as CD/DVD drives and/or LCD displays and a thermal managementsystem that is superior to conventional fans and heat sinks.

SUMMARY

The invention relates, in one embodiment, to a computing device. Thecomputing device includes an LCD display. The computing device furtherincludes

an LCD housing configured to cover at least a portion of the LCDdisplay. The computing device additionally includes a shock mountassembly configured to reduce impacts to the LCD display, and toposition the LCD display relative to the LCD housing. The shock mountassembly includes a plurality of shock mounts, which are attached to theLCD display, and which rest in a portion of the LCD housing.

The invention relates, in another embodiment, to a portable computer.The portable computer includes a structural member configured to supportthe portable computer. The portable computer further includes an opticaldisk drive including drive components and structural componentsconfigured to support the drive components. The portable computeradditionally includes a shock mount assembly configured to reduceimpacts to the optical disk drive, and to position the optical diskdrive relative to the structural member. The shock mount assemblyincludes a plurality of shock mounts, which are attached to thestructural components of the optical disk drive, and which rest in aportion of the structural member.

The invention relates, in another embodiment, to a portable computer.The portable computer includes a base having casing and a chassis. Thecasing is configured to house various components that provide computingoperations for the portable computer. The chassis is configured tosupport the casing. The casing and chassis has interior portions thatdefine an enclosed region inside the base. The portable computer furtherincludes an enclosureless optical disc drive having drive components andframe components configured to support the drive components. Theenclosureless optical disc drive is disposed inside the enclosed regionof the base. The enclosed region is arranged to surround a substantialportion of the enclosureless optical disc drive so as to shield theenclosureless optical disc drive from internal and external hazards.

The invention relates, in another embodiment, to a portable computerhaving an enclosure. The portable computer includes a structural memberassociated with the enclosure. The portable computer further includes aheat producing element disposed inside the enclosure. The portablecomputer additionally includes a heat exchanger configured to thermallycouple the heat producing element to the structural member, whereby theheat from the heat producing element is spread throughout the structuralmember via the heat exchanger.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may best be understood by reference to the followingdescription taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a perspective diagram of a portable computer, in accordancewith one embodiment of the present invention.

FIG. 2 is a broken away perspective diagram of a lid of a portablecomputer, in accordance with one embodiment of the present invention.

FIG. 3 is a front view, in cross section, of a lid of a portablecomputer, in accordance with one embodiment of the present invention.

FIG. 4 is a side elevation view, in cross section, of a shock mount usedto support a display screen in a lid of a portable computer, inaccordance with one embodiment of the present invention.

FIG. 5 is a broken away perspective diagram of a base of a portablecomputer, in accordance with one embodiment of the present invention.

FIG. 6 is a top view, with a removed section, of a base of a portablecomputer, in accordance with one embodiment of the present invention.

FIGS. 7A-C are a side elevation views, in cross section (taken along7-7′ as indicated in FIG. 6), of a shock mount assembly used to supporta CD/DVD drive in a base of a portable computer, in accordance with oneembodiment of the present invention.

FIG. 8 is a side elevation view, in cross section (taken along 8-8′ asindicated in FIG. 6), of a heat transfer system housed with a base of aportable computer, in accordance with one embodiment of the presentinvention.

FIGS. 9A-C are simplified side elevation views, in cross section, of aheat transfer system housed with a base of a portable computer, inaccordance with alternate embodiments of the present invention.

DETAILED DESCRIPTION

The invention generally pertains to a computing device. Moreparticularly, the invention pertains to arrangements for protecting keycomponents of the computing device. One aspect of the invention pertainsto shock mount arrangements that provide impact absorption to sensitivecomponents. In one embodiment, a shock mount assembly is used to supporta LCD display. In another embodiment, a shock mount assembly is used tosupport an optical disk drive such as a CD/DVD drive. Another aspect ofthe invention pertains to an enclosureless optical disk drive such as anenclosureless CD/DVD drive. By enclosureless, it is meant that theoptical disk drive does not include its own housing. In one embodiment,the enclosure and other structures of the computing device are used tohouse an enclosureless optical disk drive. Another aspect of theinvention pertains to a heat transfer system that removes heat from aheat producing element of the computing device. In one embodiment, theheat transfer system is configured to thermally couple a heat producingelement to a structural member of the computing device so as to sinkheat through the structural member, which generally has a large surfacearea for dissipating the heat. By way of example, the heat producingelement may be an integrated circuit such as a processor chip and thestructural member may be a frames, chassises, casings and/or the like.The invention is particularly useful in computing devices such asportable computers (e.g., laptops, notebooks).

Embodiments of the invention are discussed below with reference to FIGS.1-9. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes as the invention extends beyond these limitedembodiments.

FIG. 1 is a perspective diagram of a portable computer 100, inaccordance with one embodiment of the invention. The portable computer100 generally includes a base 102 and a lid 104. The base 102 isconfigured to enclose various integrated circuit chips and othercircuitry that provide computing operations for the portable computer100. By way of example, the integrated circuit chips and other circuitrymay include a microprocessor, Read-Only Memory (ROM), Random-AccessMemory (RAM), a disk drive(s), a battery, and various input/outputsupport devices. The base 102 is also configured to enclose variousstructural members for supporting the base 102. For example, thestructural members may include ribs, bars, frames and the like.

The internal components of the base 102 are generally surrounded at aperipheral region by a top case 103 and a bottom case 105 that serve tosupport the internal components in their assembled position within thebase 102. In some instances, the integrated circuit chips and othercircuitry may generate unwanted electrical emissions (EMI), andtherefore, the top and bottom cases 103 and 105, may be configured tocontain electronic emissions therein. By way of example, the innersurfaces of the top and bottom cases may be formed from a suitableshielding material, i.e., a conductive material and/or a non-conductivematerial coated with a conductive material. In other instances, theintegrated circuit chips and other circuitry may generate undesirableheat, and therefore, the top case 103 and a bottom case 105, may beconfigured to disperse the heat. By way of example, the top case 103 mayinclude a vent structure 111 that is part of a heat removal systemhoused within the base 102. In one embodiment, the top case 103 isintegrated with a heat transfer system that is arranged to transfer heataway from a heat producing element through portions of the top case 103.This embodiment will be described in greater detail below.

The base 102 is also arranged to hold a plurality of input devices suchas a keyboard 106, a track pad 107 and button(s) 108. The keyboard 106,which includes a plurality of keys, allows a user of the portablecomputer 100 to enter alphanumeric data. The track pad 107 allows a userto move an input pointer on a graphical user interface. Button(s) 108allows a user to make a selection on the graphical user interface. Asshown, the track pad 107 and button(s) 108 are located in a frontportion (or palm rest) of the base 102, and the keyboard 106 is locatedin a back portion of the base 102.

In one embodiment, the keyboard 106 is arranged to be a modular unitthat is movable relative to the base 102. That is, the keyboard 106 ismovable such that it can be coupled to and/or de-coupled from the base102. In one implementation, the movable keyboard is arranged to act as atrap door that covers an opening in the base. The opening allows useraccess to various internal components enclosed inside the base. As such,the keyboard 106 is adapted to move between a mounting condition, whichsecures the keyboard to the base and which prevents access through theopening, and a removal condition, which enables removal of the keyboardfrom the base and which allows access through the opening. By way ofexample, a movable keyboard system, which may be used in the portablecomputer 100, may be found in U.S. patent application Ser. No.09/405,552, filed on Sep. 24, 1999, and U.S. patent application Ser. No.09/755,625, filed on Jan. 4, 2001, both of which are herein incorporatedby reference.

The base 102 is also arranged to hold a disk drive for performingvarious functions related to the portable computer. By way of example,the disk drive may be an optical disc drive configured to work withoptical discs such as CD's (e.g., CD, CDR, CD-RW, Video CD), DVD's(e.g., DVD, DVD-audio, DVD-video, DVD-RW), mini-discs, magneto-opticaldiscs and the like. In the illustrated embodiment, the disk drive is aslot loaded CD/DVD drive. By slot loaded, it is meant that the CD or DVDis inserted directly into the drive rather than by an externalretractable tray that moves in and out of the drive. As such, the base102 generally includes a disk opening 109 that allows a disk 110 to beplaced in the disk drive housed within the base 102. In most cases, thedisk drive opening 109 is located in a front portion (or palm rest) ofthe base 102. By way of example, the slot loaded CD/DVD drive mayinclude an internal lock and release mechanism for holding the insertedCD or DVD disc, an internal conveying roller for conveying the CD or DVDdisc, an internal CD/DVD detector for detecting the presence of a CD orDVD disc in the disk opening 109, and a controller for actuating theconveying roller to load the CD or DVD disc when the CD/DVD detectordetects the CD or DVD disc present in the disk opening 109. It should benoted, however, that the present invention is not limited by a slotloaded CD/DVD drive and that other types of disc drives may be used,i.e., standard CD or DVD drives having trays, other optical disk drivesand/or floppy disc drives.

In one embodiment, the CD/DVD drive is an enclosureless CD/DVD drivehaving only a skeletal support structure for holding the drivecomponents of the CD/DVD drive. In another embodiment, the CD/DVD driveis shock mounted relative to the base so as to absorb shocks thereto.These embodiments will be described in greater detail below.

Referring now to the lid 104, the lid 104 is pivotally coupled to thebase 102 via a hinge mechanism 112. As such, the lid 104 may rotate intoan open position (as shown) or a closed position (not shown) relative tothe base 102. The hinge mechanism 112 is generally configured to holdthe lid 104 relative to the base 102. In one implementation, the hingemechanism 112 includes a spring element configured for continuouslyexerting a biasing force on the lid 104 in a direction away from thebase 102. In another implementation, the hinge mechanism 112 includes aclutch or cam device configured for exerting a frictional force on thelid 104 so as to maintain the position of the lid 104 when the lid 104is moved to a desired open position.

The lid 104 generally contains a liquid crystal display (LCD) 114 thatis used to display the graphical user interface (including perhaps apointer or cursor) as well as other information to the user. The LCDdisplay 114 is surrounded at a peripheral region by a bezel 116 and aLCD housing 118 that serves to support the LCD display 114 in itsassembled position within the lid 104. The bezel 116 and housing 118 mayalso serve to reduce electronic emissions emanating from within the lid104. As should be appreciated, the LCD display 114 is visible to a userof the portable computer 100 when the lid 104 is in the open positionand no longer visible to the user when the lid 104 is in a closedposition. In one embodiment, the LCD display 114 is shock mountedrelative to the lid 104 so as to absorb shocks thereto. This embodimentwill be described in greater detail below.

FIG. 2 is a broken away perspective diagram of the lid 104 including theLCD display 114, bezel 116 and LCD housing 118, in accordance with oneembodiment of the present invention. The bezel 116 and a LCD housing 118are configured for enclosing the LCD display 114 therebetween so as tosurround the peripheral regions of the LCD display 114. In theillustrated embodiment, the bezel 116 includes a front cover 132 that ispositioned in front of the LCD display 114 and a bezel wall 134 that ispositioned around the perimeter of the LCD display 114, and the LCDhousing 118 includes a back cover 136 that is positioned behind the backof the LCD display 114 and a housing wall 138 that is positioned aroundthe perimeter of the LCD display 114. The front cover 134 typicallyincludes an opening 140 for allowing a user to see the screen of the LCDdisplay 114, and the back cover 136 typically protects the backside ofthe LCD display 114 from impacts. In general, the LCD display 114 ismechanically attached to the LCD housing 118, and the bezel 116 isstructurally attached to the LCD display 114. By way of example, the LCDhousing may be attached to the LCD display via a plurality of screws,and the bezel may be attached to the LCD display via glue.

In their assembled condition (as shown in FIG. 1), the bezel 116 and LCDhousing 118 are arranged to form a box like structure that encloses theLCD display 114 (except for the opening 140). In the illustratedembodiment (FIG. 2), the bezel wall 134 extends perpendicularly from theperiphery of the front cover 132, and the housing wall 138 extendsperpendicularly from the periphery of the back cover 136. The shape ofthe bezel wall 134 generally coincides with the shape of the housingwall 138 so that a top surface 142 of the housing wall 138 abuts to abottom surface 144 of the bezel wall 134 when the lid is assembledtogether. In most cases, the two walls form an enclosure without gapstherebetween. In some instances, the LCD housing 118 provides a greateramount of support to the LCD display 114 and thus the housing wall 138is configured to be wider than the bezel wall 134. It should be noted,however, that this is not a limitation and that the lengths of the wallsmay vary according to each enclosure design. Furthermore, when mated,the combined walls create an inner wall that has substantially the samelength as the width of the LCD display 114, and an outer wall that issubstantially flush or planar, i.e., no lips.

Although not shown, the LCD housing 118 generally includes a housingplate and a housing frame, and the bezel 116 generally includes a bezelplate and a bezel frame. The frames are arranged to structurally supportthe plates. In one implementation, the plates are formed from a sheetmetal such as titanium, and the frames are formed from a plasticmaterial such carbon fiber plastic. The frames are generally arranged tosurround the perimeter of the plates, i.e., they may form a portion ofthe walls. In one implementation, the frames are structurally attachedto the plates via a structural glue so as to form a singular compositestructure, as for example, the LCD housing 118 and the bezel 116. By wayof example, techniques for gluing a frame to a plate may be found inU.S. patent application Ser. No. 09/821,784 entitled “COMPUTERENCLOSURE,” filed on Mar. 28, 2001, which is herein incorporated byreference.

To elaborate further, the LCD display 114 is configured for placementbetween the bezel 116 and the LCD housing 118. The LCD panel 114generally includes an LCD panel 146 and an LCD frame 148. The LCD panel146 is conventional and well known in the art. For example, the LCDpanel 146 typically consists of glass substrates with transparentelectrodes, a liquid crystal material placed in a gap formed between theelectrodes and sophisticated driving circuitry for energizing selectedsegments of the LCD to create the desired image. On the other hand, theLCD frame 148 is configured to provide structurally support to the LCDpanel 146. In the illustrated embodiment, the LCD frame 148 surroundsthe periphery of the LCD panel 146, and therefore the LCD frame 148defines a peripheral side portion 149 of the LCD display 114. In oneimplementation, the LCD frame 148 is formed from suitable material suchas stainless steel and structurally attached to the LCD screen 148 via astructural adhesive.

Still referring to FIG. 2, the housing wall 138 is arranged to receivethe LCD frame 148 when the LCD panel 114 is placed within the LCDhousing 118. By way of example, the inner periphery of the housing wall138 typically coincides with the outer periphery of the LCD frame 148.Similarly, the bezel wall 134 is also arranged to receive the LCD frame148 when the LCD panel 114 is placed within the bezel 116. By way ofexample, the inner periphery of the bezel wall 134 typically coincideswith the outer periphery of the LCD frame 148. A gap may be providedbetween the housing wall and the LCD frame, as well as between the bezelwall and LCD frame to provide some space for attachment. Furthermore,for cosmetic reasons, the front cover 132 is configured to cover theinterface of the LCD panel 146 and the LCD frame 148.

In accordance with one aspect of the present invention, the LCD display114 is shock mounted to the LCD housing 118 in order to protect the LCDdisplay 114 from forces that may be induced on the portable computer100. By shock mounted, it is meant that the LCD display 114 is held in asubstantially fixed position while absorbing shocks thereto. Asmentioned, the LCD display 114 is a fragile component of the portablecomputer 100. As such, it is very important to protect the LCD display114 from forces, which may distort, stress or break the LCD display 114.By way of example, the forces may be due to impacts on the LCD housing118 during transportation of the portable computer 100. A shock mountassembly is thus provided to hold the LCD display 114 and to absorbforces acting on the display so as to reduce stresses on the LCD display114. In general, the shock mount assembly allows the LCD display 114 tofloat relative to the LCD housing 118, and cushions the movements of thefloating LCD display 114, i.e., the assembly prevents the LCD display114 from running into an adjacent surface such as the LCD housing 118.

Referring to FIGS. 2-4, a shock mount assembly 150 is arranged tosupport the LCD display 114 relative to the LCD housing 118. Broadly,the shock mount assembly 150 allows the display 114 to transfer a loadinto the most structural sound place in the lid 104, i.e., the LCDhousing 118. More particularly, the shock mount assembly 150 provides anon-hysteretic way of supporting the LCD display 114 relative to the LCDhousing 118. By non-hysteretic, it is meant, for example, that the shockmount assembly 150 may be altered by an external force while having theability to return to its original non-altered configuration when thealtering force is removed. Accordingly, the LCD display 114 is held inmanner that does not distort the LCD display 114. That is, the LCDdisplay 114 is moved (albeit limited) without causing distortionsthereto.

To elaborate further, the shock mount assembly 150 includes a pluralityof compliant shock mounts 152 that are structurally attached to the LCDdisplay 114 and cooperatively attached to the LCD housing 118. Thecompliant shock mounts 152 are generally arranged to restrain thedisplay 114 in the X, Y and Z directions. The compliant shock mounts 152are disposed between the inner periphery of the housing wall 138 and theouter periphery of the LCD display 114. By placing the compliant shockmounts 152 between the display and the housing wall, the shock mounts152 can compress to compensate for undesirable forces inflicted on thedisplay. That is, the compliant shock mounts are arranged to deceleratethe floating LCD display (if it decelerates too fast it can be damaged).By way of example, the shock mounts 152 tend to compress in the Xdirection when the display 114 floats towards the sides of the housingwall 138, in the Y direction when the display 114 floats towards the topor bottom of the housing wall 138, and in the Z direction (into and outof the page in FIG. 3) when the display 114 floats towards the frontcover 132 or back cover 136. Again, the shock mounts 152 arenon-hysteretic, and therefore, they bend back to their original positionwhen the force is removed.

Described another way, the shock mounts 152 hold the LCD display 114 inspace in 6 degrees of freedom, while allowing the display some freedomto move in order to transfer energy away from the fragile display. Theconcept of DOF (degrees of freedom) refers to the number of independentcoordinates required to define its position. As is generally well known,a rigid body in three dimensions has six degrees of freedom. Forexample, 3 linear positions, e.g., represented by points along theX-axis, Y-axis and Z-axis, and 3 rotational positions represented by theangles θ_(x), θ_(y) and θ_(z), which are the rotational positions of therigid body about the X-axis, Y-axis and Z-axis respectively.

As shown in FIGS. 2 & 3, the shock mount assembly 150 generally includesmultiple (e.g., four) shock mounts 152 that are spaced apart along theouter periphery of the display 114. The multiple shock mounts 152 worktogether to provide both linear and rotational rigidity while allowingthe display 114 the ability to transfer its energy thereto. In mostcases, the shock mount assembly 150 includes a pair of spaced apartcompliant shock mounts 152 that are disposed on opposing sides of thedisplay 114 to provide DOF rigidity. In the illustrated embodiment, afirst set of shock mounts 152A are attached to a first side 153 of theLCD display 114, and a second set of shock mounts 152B are attached to asecond side 154 of the LCD display 114. The first side 153 is positionedopposite the second side 154. When placed in these positions, thecompliant shock mounts 152 are oriented parallel to both the top andbottom of the display 114. As should be appreciated, placing the shockmounts 152 on the side of the display 114 is easier than on the top andbottom of the display 114 because of the hinge mechanism that istypically located on the bottom of the display 114. It should beappreciated, however, that this is not a limitation and that theposition and orientation of the shock mounts 152 may vary according tothe specific design of each assembly. It should also be appreciated thatusing four shock mounts is not a limitation and that more or less may beused so long as they provide DOF rigidity.

Referring to FIG. 4, the shock mounts 152 will be described in greaterdetail. As shown, the shock mount 152 is disposed between the housingwall 138 and the LCD frame 148. The shock mount 152 generally includestwo elements—a longitudinal compliant member or grommet 155, and alongitudinal fastening device 156. The compliant member 155 includes afirst segment or collar 157 and a second segment 158. The outerperiphery of the first segment 157 is larger than the outer periphery ofthe second segment 158. The first segment 157 is disposed between theLCD frame 148 and the housing wall 138 and the second segment 158 isdisposed inside a mounting hole 160 in the housing wall 138.

Broadly, the first segment 157 fills a gap 161 formed between the LCDframe 148 and housing wall 138, and the second segment 158 fills thespace formed by the mounting hole 160. More specifically, a distal end162 of the first segment 157 abuts to the peripheral side portion 149 ofthe LCD frame 148 and a proximal end 163 of the first segment 157 abutsto an inner side 164 of the housing wall 138. In addition, an outerperiphery 165 of the second segment 158 abuts to an inner periphery 166of the mounting hole 160 of housing wall 138. In most cases, the LCDdisplay 114 is not structurally fixed to the LCD housing 118, but ratherrests inside the LCD housing 118, i.e., the LCD housing 118 supports theshock mount 152, and thus the LCD display 114. It is generally desirableto have the segments 157, 158 tightly held (but not too tight) by theadjacent surfaces 149, 164, 166.

The shock mount 152 also includes a through hole 167 for receiving thefastening device 156. As shown, the through hole 167 extends through theshock mount 152. The fastening device 156 includes a first portion 168that is adapted to mate with the through hole 167 and a second portion169 that is adapted to mate with the LCD frame 148. In the illustratedembodiment, the fastening device 156 is a screw that is threadablycoupled to the LCD frame 148, i.e., the second portion 169 represents athreaded element for coupling to a threaded receiving element positionedon the LCD frame 148. In addition, the first portion 168 is sized tosnugly fit inside the through hole 167, i.e., the outer periphery of thefirst portion abuts to the inner periphery of the through hole. As such,the first portion 168, which is fixed to the LCD display, is going tohit the compliant member 155 and compress it whenever a force causes thedisplay to move.

In most cases, the compliant member 155 is formed from a suitablecomplaint material such as an elastomer (sufficiently rigid butpliable), and the fastening device 156 is formed from a suitable rigidmaterial such as steel. It should be understood, however, that thesematerials are not a limitation and that other suitable materials may beused. For example, the compliant member may be formed from rubber,silicone, soft plastics and the like.

FIG. 5 is a broken away perspective diagram of the base 102 includingthe top case 103 and the bottom case 105, in accordance with oneembodiment of the present invention. As shown, the top case 103generally includes a top plate 170 and a top frame 172, and the bottomcase 105 generally includes a bottom plate 174 and a bottom frame 176.The top frame 172 is arranged to structurally support the periphery ofthe top plate 170 while the bottom frame 176 is arranged to structurallysupport the periphery of the bottom plate 174. In the illustratedembodiment, the top and bottom plates 170, 174 are formed from asuitable shielding material and the top and bottom frames 172, 176 areformed from a suitable plastic material. By way of example, the top andbottom plates 170, 174 may be formed from titanium sheet metal and thetop and bottom frames 172, 176 may be formed from a carbon fiber filledplastic. As should be appreciated, titanium sheet metal provides greatelectronic shielding while increasing the strength and reducing theweight of the portable computer 100 (e.g., titanium is stronger thansteel, but lighter than aluminum). In addition, carbon fiber plasticprovides a rigid structure that is both strong and light. Moreover, bothtitanium and carbon fiber plastic are thermally conductive. In oneembodiment, the inner surfaces of the frames 172, 176 are selectivelycoated with a conductive layer so as to shield the remaining portions ofthe base 102. By way of example, the inner surfaces of the frames 172,176 may be selectively plated with a Nickel or Nickel-Copper material.

It should be noted that the above elements are not a limitation and thatthey may vary according to the specific needs of each enclosure. Forexample, steel sheet metal may be used to form the top and bottomplates, and the top and bottom frames may be formed from other materialsincluding polycarbonate. Moreover, the conductive layer may be appliedby coating, painting, depositing and/or the like. Additionally, theconductive layer may be formed from other suitable materials or coatingssuch as silver. As should be appreciated, the thickness of theconductive layer may vary (larger or smaller) according to the type ofmaterial used and the method for applying the material.

During assembly, the top plate 170 is structurally bonded to the topframe 172 and the bottom plate 174 is structurally bonded to the bottomframe 176. In one embodiment, an adhesive is used to attach the topframe 172 to the top plate 170 and to attach the bottom frame 176 to thebottom plate 174 so as to form a singular composite top case 103 and asingular composite bottom case 105. In one implementation, the adhesiveis a glue that is compliant when dispensed and then cures to a rigidstructure over time. The glue is preferably configured to exhibit goodstrength characteristics and good adhesion between the top frame 172 andthe top plate 170 and between the bottom frame 176 and the bottom plate174. The glue is also configured to reduce tolerance variability in theoverall geometry of the top and bottom cases 103, 105.

In addition, the top plate 170 is electrically bonded to the top frame172 and the bottom plate 174 is electrically bonded to the bottom frame176. In one embodiment, a conductive paste is used to attach the topframe 172 to the top plate 170 and to attach the bottom frame 176 to thebottom plate 174 so as to electrically seal the interfaces therebetween.The conductive paste preferably exhibits good electrical characteristicsand good adhesion between the conductive layer disposed on the innersurfaces of the frames and the top and bottom plates 170, 174. Like theglue, the conductive paste generally has two states—a compliant stateand a rigid state. By way of example, techniques for structurally andelectrically gluing a frame to a plate may be found in U.S. patentapplication Ser. No. 09/821,784 entitled “COMPUTER ENCLOSURE,” filed onMar. 28, 2001, which is herein incorporated by reference.

To elaborate further, the top plate 170 is configured for placementwithin the top frame 172. The top frame 172 includes a plate opening 180for receiving a raised portion 182 of the top plate 170, and a flangeportion 184 for receiving a first recessed portion 186 of the top plate170. For example, the shape of the plate opening 180 typically coincideswith the shape of the raised portion 182. In one embodiment, the opening180 has an inner peripheral surface 181 that is configured tosubstantially mate with an outer peripheral surface 183 of the raisedportion 182 when the raised portion 182 is placed within the opening180. In another embodiment, a top surface 188 of the top plate 170 isconfigured to be flush with a top surface 190 of the top frame 172 whenthe raised portion 182 of the top plate 170 is placed within the plateopening 180 of the top frame 172 (as shown in FIG. 1).

The top frame 172 also includes a wall portion 192 that extends belowthe flange portion 184. As shown, the outer periphery 193 of the wallportion 192 makes up a portion of the exterior of the base 102 while theinner periphery 194 of the wall portion 192 is configured to surroundthe outer periphery 195 of the recessed portion 186 when the top plate170 is placed within the top frame 172. The wall portion 192 includesvarious openings for providing access to components of the portablecomputer 100. For example, a front of the top frame 172 generallyincludes a drive opening 109 for allowing access to a disk drive such asa floppy, zip, CD or DVD drive, and the sides of the top frame 172generally include vent structures 111 for allowing the passage of air.

Further still, the raised portion 182 includes a keyboard opening 196and a track pad opening 198. The keyboard opening 196 is adapted forreceiving the movable keyboard 106, and the track pad opening 198 isadapted for receiving the stationary track pad 108 and button(s) 110. Asmentioned, the keyboard opening 196 is arranged to allow access tovarious internal components of the portable computer 100 when themovable keyboard 106 is moved away from the opening 196. By way ofexample, the opening 196 may allow an operator of the portable computer100 to upgrade internal components such as a modem, memory, hard driveand/or the like.

The movable keyboard 106 generally includes a base plate 200, which isarranged to support a plurality of keys, and which is configured forplacement within the opening 196. For example, the shape of the opening196 typically coincides with the shape of the base plate 200. In oneembodiment, the opening 196 has an inner periphery 202 that isconfigured to mate with an outer periphery 204 of the base plate 200when the keyboard 106 is placed within the opening 196. The top plate170 also includes a recessed lip 206 for supporting a bottom edge of thebase plate 200 when the movable keyboard 106 is placed within theopening 196. As shown, the lip 206 extends into the opening 196 past theinner periphery 202 of the opening. In most cases, the recessed lip 206is configured to position a top surface of the base plate 200substantially flush with a top surface of the base 102 (as shown in FIG.1).

To elaborate even further, the bottom frame 176 is configured forplacement within the bottom plate 174. The bottom plate 174 includes abottom surface 210 and a bottom plate wall 212 extending upwardstherefrom. The bottom surface 210 is arranged for receiving a flangeportion 214 of the bottom frame 176, and the bottom plate wall 212 isarranged for receiving a bottom frame wall 216 extending upwards fromthe flange portion 214. The outer periphery of the bottom frame wall 216is arranged to substantially coincide with the inner periphery of thebottom plate wall 214. Furthermore, a top surface 222 of the bottomplate wall 212 is configured to extend above the peripheral edge 224 ofthe bottom frame wall 216 when the bottom frame 176 is attached to thebottom plate 174.

In their assembled condition (as shown in FIG. 1), the top and bottomcases 103, 105 are arranged to electrically and mechanically couple toone another so as to form a box like structure (e.g., base 102) thatencloses various internal components. In most cases, for example, thetop and bottom cases 103, 105 are adapted for engagement and coupled toone another via a fastening device. In one embodiment, the peripheraledges of the top case are adapted to mechanically and electricallyengage the peripheral edges of the bottom case, and a plurality ofscrews are used to hold the two cases 103, 105 together. In theillustrated embodiment, the top surface 224 of the bottom frame wall 216is arranged to interface with a bottom surface 226 of the top frame wall192, and an inner edge 228 of the bottom plate wall 212 is arranged tointerface with an outer portion 230 of the top frame wall 192. By way ofexample, the top surface 224 of the bottom frame wall 216 may include aslot for receiving a hook disposed on the bottom surface 226 of the topframe wall 192. When mated, the combined walls 212, 230 preferably forman outer wall that is substantially flush or planar, i.e., no lips.

As shown in FIG. 5, the internal components, which are enclosed by thetop case and bottom cases 103, 105, may include a CD/DVD drive 232, aprinted circuit board 234, a heat transfer system 236, and a rib chassis238. It should be understood, however, that these components are not alimitation, and are only shown to simplify discussion and to furtherdescribe various embodiments of the invention. The CD/DVD drive 232 isconfigured for accepting a CD or DVD disc onto which data can be storedor retrieved. The printed circuit board 234 (e.g., motherboard) isconfigured for carrying a plurality of integrated circuits associatedwith operating the portable computer. The heat transfer system 236,which is attached to the printed circuit board 234, is configured forcooling the integrated circuits and other electronic components. The ribchassis 238 is configured for supporting the base 102 and some internalcomponents housed within the base 102. The components 232-238 aregenerally disposed between the top case 103 and the bottom case 105, andmore particularly between the top and bottom frames 172, 176 and the topand bottom plates 170, 176. For example, the top frame 172 and bottomplate and frame 174, 176 provide walls for surrounding the components232-238, and the top plate 170 and bottom plate 174 provide surfaces forcovering the components 232-238.

The rib chassis 238 generally includes a plurality of ribs 240 that areattached to the base 102. For example, the ribs 240 may be attached tothe top case 103 and bottom case 105 via a plurality of screws, slotsand/or adhesives. In most cases, the ribs 240 extend in multipledirections so as to support the base 102 and to define open areas insidethe base 102 for placement of the internal components. By way ofexample, the ribs 240 may define a modem area, a PC card area, a RAMarea, a heat transfer system area, a CD/DVD drive area, and/or the like.The rib chassis 238 may also serve to reduce electronic emissionsemanating from within each of these areas. For example, the rib chassismay be formed from a carbon fiber plastic and have a conductive layerapplied thereto. The printed circuit board 234 is typically attached tothe rib chassis 238. By way of example, the printed circuit board 234may be attached to the ribs 240 via a plurality of screws, slots and/oradhesives. The CD/DVD drive 232 is generally attached to the base 102and the rib chassis 238. As shown, the printed circuit board 234includes a cut out portion for allowing the CD/DVD drive 232 to beplaced between the ribs 240 of the rib chassis 238 and the walls 192 ofthe top frame 172 so as to cooperatively position the CD/DVD drive 232relative to the opening 109.

In accordance with one aspect of the present invention, an enclosurelessCD/DVD drive is installed into the base. By enclosureless, it is meantthat the CD/DVD drive does not include its own housing and thus it isthinner, lighter and cheaper than conventional CD/DVD drives. Although ahousing is not included, the enclosureless CD/DVD drive does includedrive components and frame components. The drive components typicallyconsist of a laser, light sensing diode, and a spindle motor, and theframe components typically consist of structural members that supportthe drive components. The frame components typically take the form of askeletal system and therefore there are many openings surrounding thedrive components. Unfortunately, these openings allow the passage ofundesirable electronic emissions and unwanted loose particles (dust).Portions of the base are thus configured to house the enclosurelessCD/DVD drive. For instance, portions of the top case, bottom case, andrib chassis may be configured to form a CD/DVD drive housing inside thebase that can shield the enclosureless CD/DVD drive from internal andexternal hazards. That is, the top case, bottom case, and rib chassismay form an enclosed region that surrounds a substantial portion of theenclosureless CD/DVD drive.

Referring to FIGS. 5-7, an enclosureless CD/DVD drive 232 is housedwithin the base 102. More particularly, the top case 103, bottom case105 and rib chassis 238 are configured for enclosing the enclosurelessCD/DVD drive 232 therebetween so as to surround the peripheral regionsof the drive 232. In the illustrated embodiments, the internal enclosure242 includes a first side wall 242A for covering a first side 244 of thedrive 232, a second side wall 242B for covering a second side 246 of thedrive 232, a front wall 242C for covering a front side of the drive 232,a back wall 242D for covering a back side of the drive 232, a top wall242E for covering a top side of the drive 232, and a bottom wall 242Ffor covering a bottom side of the drive 232. As should be appreciated,the first side wall 242A is formed by a combination of the top framewall 192′ and the bottom frame wall 216′, the second side wall 242B isformed by a first rib 240A, the front wall 242C is formed by acombination of the top frame wall 192″ and the bottom frame wall 216″,the back side wall 242D is formed by a second rib 240B, the top wall242E is formed by the top plate 170 (removed portion in FIG. 6), and thebottom wall 242F is formed by the bottom plate 174.

As shown in FIG. 6, the first side wall 242A and the front wall 242C area continuous section of the top and bottom frame walls 192/216, and thesecond side wall 242B and the back side wall 242D are a continuoussection of the rib chassis 238. The rib 240A is configured to abut tothe top and bottom frame walls 192/216″ to seal the interface betweenfront wall 242C and the second side wall 242B, and the rib 240B isconfigured to abut to the top and bottom frame walls 192/216′ to sealthe interface between the back wall 242D and the first side wall 242A.As shown in FIG. 7, the top plate 170 is configured to abut to the topsurface of the top frame wall 192 and the rib 240A to seal the interfacebetween the walls 242A-D and the top wall 242E, and the bottom plate 174is configured to abut to the bottom surface of the bottom frame wall 216and the rib 240A to seal the interface between the walls 242A-D and thebottom wall 242F. Accordingly, all of the sides of the enclosurelessCD/DVD drive 232 are enclosed when the enclosureless CD/DVD drive 232 isassembled inside the base 102.

Referring to FIGS. 5-7, the enclosureless CD/DVD drive 232 is configuredfor placement within the base 102 and more particularly between portionsof the top case 103, bottom case 105 and rib chassis 238. Theenclosureless CD/DVD drive 232 generally includes a base member 250 anda top cover 252. The base member 250 is configured for structurallysupporting the sensitive components of the drive 232 and the top cover252 is configured for covering the sensitive components of the drive232. By way of example, the cover 252 may be arranged to block thepassage of light emanating from the laser of the drive. The base member250 generally includes a base portion 254 and side portions 256extending therefrom. The side portions 256 include a flange portion 258for receiving the bottom surface of the cover 252. In some cases, theflange portions 258 include a threaded receptacle for receiving a screwso as to attach the cover 252 to the base member 250. Although the basemember 250 and cover 252 surround the periphery of the drive components,the combination of the base member 250 and cover 252 leaves a pluralityof openings therebetween. This is generally done to reduce the overallweight of the drive 232. In one embodiment (as shown in FIG. 5), thecover 252 includes an extension 252A for covering the moving laserunderneath (typically this is not done because conventional drives havean enclosure that already serves this function). As should beappreciated, it is generally desirable to block laser light fromemanating outside the drive so as to meet computer standards. In oneimplementation, the base member 250 is formed from suitable materialsuch as stainless steel and the cover 252 is formed from a suitablematerial such as aluminum.

In one embodiment (as shown in FIGS. 5 & 6), a thin flexible sheath 259may be used to surround at least a portion of the enclosureless CD/DVDdrive 232 to further prevent dust and loose particles from reaching thedrive components of the enclosureless CD/DVD drive 232. For instance,there may be portions of the internal enclosure 242 that are leftunsealed and therefore unwanted particles may enter therethrough. By wayof example, a portion of the CD/DVD drive 232 may extend into the regionbelow the keyboard opening 196. As such, when the keyboard 106 isremoved, an open pathway to the enclosureless CD/DVD drive 232 mayexist. Therefore, in one implementation, the flexible sheath 259 isconfigured to cover portions of the enclosureless CD/DVD drive 232 thatare left exposed. For example, referring to FIG. 6, the flexible sheath259 may be configured to extend to a point beyond an edge 260 of thekeyboard opening 196 so as to prevent particles from reaching theenclosureless CD/DVD drive 232. The flexible sheath 259 is generallysized to fit over the base member 250, cover 252 and side portions 256of the drive 232 so as to cover exposed parts of the sides, top, bottomand backside of the drive 232. The thin flexible sheath may be formedfrom a suitable material such as mylar. It should be noted, however,that this is not a limitation and that other materials may be used.

In accordance with one aspect of the present invention, the CD/DVD drive232 is shock mounted to the structural members associated with the base102 in order to protect the CD/DVD drive 232 from forces that may beinduced on the portable computer 100. By shock mounted, it is meant thatthe CD/DVD drive 232 is held in a fixed position while absorbing shocksthereto. As mentioned, the CD/DVD drive 232 is a fragile component ofthe portable computer 100. As such, it is very important to protect theCD/DVD drive 232 from forces, which may distort, stress or break thesensitive components of the CD/DVD drive 232. By way of example, theforces may be due to impacts on the base 102 during transportation ofthe portable computer 100. A shock mount assembly is thus provided tohold the CD/DVD drive 232 and to absorb forces acting on the drive 232so as to reduce stresses on the CD/DVD drive 232. In general, the shockmount assembly allows the CD/DVD drive 232 to float relative to the base102, and cushions the movements of the floating CD/DVD drive 232, i.e.,the assembly prevents the drive 232 from running into an adjacentsurface such as the top/bottom cases 103, 105 and rib chassis 238.

Referring to FIGS. 5-7, a shock mount assembly 261 is arranged tosupport the CD/DVD drive 232 relative to the base 102. Broadly, theshock mount assembly allows the drive to transfer a load into the moststructural sound place in the base, i.e., the top case, bottom case andrib chassis. More particularly, the shock mount assembly 261 provides anon-hysteretic way of supporting the CD/DVD drive 232 relative to thestructural components of the base 102, i.e., the rib chassis 238 and thetop frame wall 192. By non-hysteretic, it is meant, for example, thatthe shock mount assembly 261 may be altered by an external force whilehaving the ability to return to its original non-altered configurationwhen the altering force is removed. By way of example, the externalforce may be caused by an impact to the top or bottom cases 103, 105.Accordingly, the CD/DVD drive 232 is held in manner that does notdistort the CD/DVD drive 232. That is, the CD/DVD drive 232 is moved(albeit limited) without causing distortions.

To elaborate further, the shock mount assembly 261 includes a pluralityof compliant shock mounts 262 that are structurally attached to theCD/DVD drive 232 and cooperatively attached to both the rib 240A and thetop and bottom frame walls 192′/216′. The compliant shock mounts 262 aregenerally arranged to restrain the drive 232 in the X, Y and Zdirections. The compliant shock mounts 262 are disposed between theinner periphery of the top frame wall 192′ and the outer periphery ofthe CD/DVD drive 232 as well as between the inner periphery of the rib240A and the outer periphery of the CD/DVD drive 232. By placing thecompliant shock mounts 262 between the drive and the top frame wall andrib, the shock mounts 262 can compress to compensate for undesirableforces inflicted on the drive. That is, the compliant shock mount arearranged to decelerate the floating CD/DVD drive 232 (if it acceleratestoo fast it can be damaged). By way of example, the shock mounts 262tend to compress in the X direction when the drive 232 floats towardsthe rib 240A or top frame wall 192′, in the Y direction when the drive232 floats towards the rib 240B or top frame wall 192″, and in the Zdirection when the drive 232 floats towards the bottom plate 174 or topplate 170. Again, the shock mounts 262 are non-hysteretic, andtherefore, they bend back to their original position when the force isremoved.

Described another way, the shock mounts 262 hold the CD/DVD drive 232 inspace in 6 degrees of freedom, while allowing the display some freedomto move in order to transfer energy away from the sensitive componentsof the drive. As previously mentioned, DOF (degrees of freedom) refersto the number of independent coordinates required to define itsposition. As is generally well known, a rigid body in three dimensionshas six degrees of freedom. For example, 3 linear positions, e.g.,represented by points along the X-axis, Y-axis and Z-axis, and 3rotational positions represented by the angles θ_(x), θ_(y) and θ_(z),which are the rotational positions of the rigid body about the X-axis,Y-axis and Z-axis respectively.

As shown in FIGS. 5-7, the shock mount assembly 261 generally includesmultiple (e.g., four) shock mounts 262 that are spaced apart along theouter periphery of the drive 232. The multiple shock mounts 262 worktogether to provide both linear and rotational rigidity while allowingthe drive 232 the ability to transfer its energy thereto. In most cases,the shock mount assembly 261 includes a pair of spaced apart compliantshock mounts 262 that are disposed on opposing sides of the drive 232 toprovide DOF rigidity. In the illustrated embodiment, a first set ofshock mounts 262A are attached to a first side 266 (or A side) of thedrive 232, and a second set of shock mounts 262B are attached to asecond side 268 (or B side) of the drive 232. The first side 266 ispositioned opposite the second side 268. When placed in these positions,the compliant shock mounts 262 are oriented parallel to both the frontand back of the drive 232. As should be appreciated, placing the shockmounts 262 on the side of the drive 232 is easier than on the front andback of the drive 232 because of the opening 109 required to accept theCD/DVD disc. It should be appreciated, however, that this is not alimitation and that the position and orientation of the shock mounts 262may vary according to the specific design of each assembly. It shouldalso be appreciated that using four shock mounts is not a limitation andthat more or less may be used so long as they provide DOF rigidity.

Referring to FIGS. 7A-C, the shock mounts 262 will be described ingreater detail. As shown, the first set of shock mounts 262A aredisposed between the top/bottom frame wall 192/216′ and a first sideportion 256A of the base member 250, and the second set of shock mounts262B are disposed between the rib 240A and a second side portion 256B ofthe base member 250. Like the shock mounts described previously, each ofthe shock mounts 262 include two elements—a longitudinal compliantmember or grommet 274, and a longitudinal fastening device 276.

Referring to both FIGS. 7B & 7C, the compliant member 274 includes afirst segment 278 and a second segment 280. The outer periphery of thefirst segment 278 is larger than the outer periphery of the secondsegment 280.

As shown in FIG. 7B, on the first side of the drive 232, the firstsegment 278A is disposed between the frame walls 192/216′ and the firstside portion 256A, and the second segment 280A is disposed inside amounting hole 282A defined by the frame walls 192/216′. In theillustrated embodiment, the top frame wall 192′ includes a firstmounting bracket 284, and the bottom frame wall 216′ includes a secondmounting bracket 286. In most cases, a bottom portion of the firstmounting brackets is arranged to cooperate with a top portion of thesecond mounting bracket to form the mounting hole 282A. By way ofexample, both the bottom and top portions may include a cut out portionthat when combined form the shape of the mounting hole 282A.

Broadly, the first segment 278A fills a gap 290A formed between theframe walls 192/216′ and the first side portion 256A, and the secondsegment 280A fills the space formed by the mounting hole 282A. Morespecifically, a distal end 291A of the first segment 278A abuts to anouter surface 292A of the first side portion 256A and a proximal end293A of the first segment 278A abuts to an inner side 294 of the framewalls 192/216′. In addition, an outer periphery of the second segment280A abuts to an inner periphery of the mounting hole 282A of the framewalls 192/216′. As such, the drive 232 is not structurally fixed to theframe walls 192/216′, but rather rests inside the frame walls 192/216′,i.e., the frame walls 192/216′ supports the shock mount 262A, and thusthe drive 232. It is generally desirable to have the segments tightlyheld (but not too tight) by the adjacent surfaces 291, 294.

As shown in FIG. 7C, on the second side of the drive 232, the firstsegment 278B is disposed between the rib 240A and the second sideportion 256B, and the second segment 280B is disposed inside a mountinghole 282B in the rib 240A. Broadly, the first segment 278B fills a gap290B formed between the rib 240A and the second side portion 256B, andthe second segment 280B fills the space formed by the mounting hole282B. More specifically, a distal end 291B of the first segment 278Babuts to an outer surface 292B of the second side portion 256B and aproximal end 293B of the first segment 278 abuts to an inner side 297 ofthe rib 240A. In addition, an outer periphery of the second segment 280Babuts to an inner periphery of the mounting hole 282B of the rib 240A.As such, the drive 232 is not structurally fixed to the rib 240A, butrather rests inside the rib 240A, i.e., the rib 240A supports the shockmount 262B, and thus the drive 232. Again, it is generally desirable tohave the segments tightly held (but not too tight) by the adjacentsurfaces 291, 297.

The shock mounts 262 also includes a through hole 300 for receiving thefastening device 276. As shown, the through hole 300 extends through theshock mount 262. The fastening device 276 includes a first portion 302that is adapted to mate with the through hole 300 and a second portion304 that is adapted to mate with the base member 250. In the illustratedembodiment, the fastening device 276 is a screw that is threadablycoupled to the base member 250, i.e., the second portion 304 representsa threaded element for coupling to a threaded receiving elementpositioned on the base member 250. In addition, the first portion 302 issized to snugly fit inside the through hole 300, i.e., the outerperiphery of the first portion abuts to the inner periphery of thethrough hole. As such, the first portion 302, which is fixed to theCD/DVD drive, is going to hit the compliant member 274 and compress itwhenever a force causes the drive to move.

In most cases, the compliant member 274 is formed from a suitablecomplaint material such as an elastomer (sufficiently rigid butpliable), and the fastening device 276 is formed from a suitable rigidmaterial such as steel. It should be understood, however, that thesematerials are not a limitation and that other suitable materials may beused. For example, the compliant member may be formed from rubber,silicone, soft plastics and the like.

In accordance with another aspect of the present invention, a heattransfer system is provided to remove heat from heat producing elementshoused within the portable computer. The heat transfer system isgenerally configured to thermally couple a heat producing element, suchas a IC chip, to a structural member of the portable computer so as todissipate the heat through the structural member, i.e., the heattransfer system sinks heat into the structural member. By way ofexample, the structural member may be a rib chassis, top case and/orbottom case. As such, the heat transfer system takes advantage of someof the largest heat sink structures found in the portable computer,i.e., structural members such as the rib chassis, top case and/or bottomcase provide a large surface area for spreading the undesirable heat.

The heat transfer system generally includes a heat sink device that isthermally coupled to the heat producing element. By way of example, theheat sink device may include a first surface that is in thermal contactwith a surface of an IC chip. In one embodiment, the heat sink workswith a heat pipe to move the heat from a heat producing element to astructural member. By way of example, the heat pipe may include a firstsurface that is in thermal contact with the heat sink device and asecond surface that is in thermal contact with the structural member. Inanother embodiment, the heat sink device is positioned thermallyadjacent to a structural member so as to move the heat from a heatproducing element to the structural member. By way of example, the heatsink device may include a second surface that abuts or is in closeproximity to a surface of the structural member. In another embodiment,the heat sink device is thermally integrated with a structural member soas to directly move the heat from a heat producing element to thestructural member. By way of example, the heat sink device may be aportion of the structural member having a first surface that is inthermal contact with a surface of an IC chip.

Referring to FIGS. 5, 6 and 8, the heat transfer system 236 is arrangedto dissipate heat from a plurality of IC chips 310 attached to theprinted circuit board 234. As is generally well known, IC chips generateheat and are therefore susceptable to overheating. Overheating may leadto errors in the functionality of the chip. The problem is compounded bythe ever increasing speed of IC chips.

The heat transfer system 236 generally includes a plurality of heatsinks 312 thermally coupled to the plurality of chips 310, and a heatpipe 314 thermally coupled between the plurality of heat sinks 312 andthe top plate 170 of the top case 103. The heat sinks 312 are arrangedto carry heat away from the plurality of chips 310, and the heat pipe314 is arranged to carry heat away from the heat sinks 312. That is, theheat sink 312 and heat pipe 314 form a thermal path from the IC chips310 to the top plate 170. As mentioned, the top plate 170 is formed froma thermally conductive material, i.e., sheet metal, and therefore theheat is spread over the entire area of the top plate 170. As should beappreciated, by increasing the surface area, more heat can bedissipated, and thus the portable computer 100 can use “hotter” chipswithout having to use a bigger fan.

The heat sinks are generally formed from thermally conductive materialssuch as extruded aluminum. In one implementation, the heat pipe is anevaporation/condensation type heat pipe. Evaporation/condensation typeheat pipes generally include an outer copper tube having anevaporation/condensation mechanism disposed therein. It should beunderstood, however, that this is not a limitation and that other typesof heat pipes may be used.

As shown in FIG. 8, the plurality of chips 310 includes a first chip310A, a second chip 310B, a third chip 310C and a fourth chip 310D. Byway of example, the first chip 310A may be a graphics chip, the secondchip 310B may be a bridge chip, the third chip 310C may be a processorchip, and the fourth chip 310D may be a cache chip. It should beunderstood that this is not a limitation and that other types of chipsmay be used. It should also be noted that a varying number of chips maybe used, i.e., one, six, twenty, etc. As shown, each of the IC chips 310has a heat sink 312 thermally attached thereto. In the illustratedembodiment, a first heat sink 312A is thermally coupled to the first andsecond chips 310A-B, a second heat sink 312B is thermally coupled to thethird chip 310C, and a third heat sink 312C is thermally attached to theforth chip 310D. The heat sinks 312 are generally attached to the chipsusing conventional techniques. By way of example, a thermal interfacematerial such as thermal grease may be used to attach the heat sinks tothe chips.

Each of the heat sinks 312 includes a body 316 having a planar surface318 that interfaces a top surface of the chip 310, and a plurality offins 320 extending upwards therefrom. For example, the first heat sink312A includes a first body 316A, a first planar surface 318A, and firstfins 320A. As shown, the first body 316A includes an extended body 322for connecting to the first chip 310A. As such, the first planar surface318A interfaces the top surface of the first chip and second chips310A-B. In addition, the second heat sink 312B includes a second body316B, a second planar surface 318B and second fins 320B. The secondplanar surface 318B interfaces the top surface of the third chip 310C.Moreover, the third heat sink 312C includes a third body 316C, a thirdplanar surface 318C and third fins 320C. The third planar surface 318Cinterfaces the top surface of the fourth chip 310D. In most heat sinks312, the fins 320 are spaced apart to provide an optimum amount ofsurface area from which heat can dissipate, i.e., natural convection. Asis generally well known, the size, length, number and orientation of thefins can greatly effect the amount of heat dissipated. Although heatsinks with a plurality of straight fins are shown, it should beunderstood that any type of heat sink device may be used.

Referring to FIGS. 6 & 8, each of the heat sinks 312 is thermallyattached to the heat pipe 314. That is, the heat pipe 314 is intimatelyconnected to all of the heat sinks 312 so as to pump heat from the heatsinks 312 into the base 102, and more particularly the top case 103. Inthe illustrated embodiment, each of the bodies 316A-C includes a heatpipe opening, respectively, for receiving the heat pipe 314 therein.With regards to the first heat sink 312A, the first body 316A includes aheat pipe cavity 324 that is adapted to receive a first end 326 of theheat pipe 314. With regards to the second heat sink 312B, the secondbody 316B includes a first heat pipe tunnel 328 that is adapted toreceive a first longitudinal segment 330 of the heat pipe 314therethrough. With regards to the third heat sink 312C, the third body316C includes a second heat pipe tunnel 332 that is adapted to receive asecond longitudinal segment 334 of the heat pipe 314 therethrough. Whenassembled, the first end 326 of the heat pipe 314 is disposed inside thecavity 324, the first longitudinal segment 330 is disposed inside thefirst tunnel 328, and the second longitudinal segment 334 is disposedinside the second tunnel 332. The heat pipe 314 is typically attached tothe heat sinks 312 using conventional techniques. By way of example, theheat pipe 314 can be attached to the heat sinks by soldering, brazing orother similar attachment means.

After exiting the third heat sink 312C, the heat pipe 314 generallyextends through a hole in the rib 240C and bends upwards (e.g., elbows)to the top plate 170. In most cases, a second end 336 of the heat pipe314 is attached to the top plate 170 via an auxiliary plate 338. Theauxiliary plate 338 is generally formed from a thermally conductivematerial such as aluminum, and serves to thermally couple the heat pipe314 to the top plate 170. As shown, a top surface 340 of the auxiliaryplate 338 is attached to an underside 342 of the top plate 170, and thesecond end 336 of the heat pipe 314 is attached to a bottom surface 344of the auxiliary plate 338. As such, the heat pipe 314 directs heat tothe auxiliary plate 338, and the auxiliary plate 338 directs heat to thetop plate 170. The heat pipe 314 is generally attached to the auxiliaryplate 338, and the auxiliary plate 338 is attached to the top plate 170using conventional techniques. By way of example, the heat sink pipe maybe attached to the auxiliary plate by soldering, brazing or othersimilar attachment means, and the auxiliary plate may be screwed orotherwise fastened to the top plate. Thermal grease may be disposedbetween the auxiliary plate and the top plate to produce a betterthermally coupled interface.

It should be understood that this configuration is not a limitation andthat other configurations may be used. For example, the heat pipe may beattached directly to the top plate, and may extend below or above therib. In addition, the heat pipe may extend downwards and attach to thebottom plate. Furthermore, the auxiliary plate may include a channel orcavity for receiving the second end of the heat pipe.

Referring to FIGS. 5, 6 and 8, the heat transfer system 236 is generallydisposed in a region of the base 102 defined by the walls of the ribchassis 238 and the top and bottom cases 103, 105. For example, amajority of the heat transfer system 236 may be positioned between therib 240C and a rib 240D as well as between a rib 240E and the top/bottomframe wall 192/216 of the cases 103, 105. The heat transfer system 236may also extend into other portions of the base 102. For example,portions of the heat transfer system 236 may extend under, through orover the rib chassis walls, i.e., rib 240C and rib 240D. In theillustrated embodiment, the rib 240D includes a cut away section forallowing the extended base 322 of the first heat sink 312A to passunderneath the rib 240D.

In one embodiment, the heat sinks are also arranged to move heat awayfrom the plurality of chips by being positioned proximate the ribchassis. That is, the position of the heat sink may form a thermal pathfrom the IC chip to the rib chassis. In this embodiment, the rib chassisis formed from a thermally conductive material, and therefore the heatis spread over the entire area of the rib chassis. In oneimplementation, the thermally conductive material is plastic (e.g.,carbon fiber plastic). In another implementation, the thermallyconductive material is a metal (e.g., magnesium). In yet anotherimplementation, the thermally conductive material is a composite havingboth metal and plastic therein.

Referring to FIG. 8, the first heat sink 312A is positioned proximate tothe rib 240D, and the third heat sink 312C is positioned proximate tothe rib 240C so as to provide a thermal path from the heat sinks 312 tothe rib chassis 238. As shown, the first heat sink 312A includes a sidesurface 350 that is adjacent to an inner surface 352 of the rib 240D,and the third heat sink 312C includes a side surface 354 that isadjacent to an inner surface 356 of the rib 240C. Although the surfacesare shown with a gap therebetween, it should be appreciated that thecloser the surfaces are to one another (i.e., abutting), the better thetransfer of heat away from the IC chips 310.

The heat transfer system may also include a fan unit for producing anairflow inside the base. Because of the above mention arrangement, i.e.,transferring heat to structural members, the fan unit can be a small,low profile and low power consuming device that produces less noise thanconventional fans.

As shown in FIG. 6, a fan unit 358 is positioned proximate the heatsinks 312. In general, the fan unit 358 is arranged to pull air from theambient and into the base 102 in order to send cooling air across theheat sinks 312 thus carrying heat away from the IC chips 310. In theillustrated embodiment, the fan unit 358 is placed behind the secondheat sink 312B. This is generally done to force a greater amount of airover the chip (e.g., CPU) that produces the most heat. The configurationof the fins 320 are typically arranged to create optimal air flowbetween and around the fins. As should be appreciated, the fins 320B ofthe second heat sink 312B are positioned parallel to the flow of air sothat air can readily flow through the fins 320B. After flowing over thesecond heat sink 312B, the air flow is split into at least two air flowstreams. The two air flow streams are directed towards vent structures111 located on opposing sides of the base 102. The vent structures 111are generally disposed in the top frame wall 192 of the top case 103,and located towards the rear of the base 102.

Turning now to FIG. 9A, an alternative embodiment to the presentinvention is illustrated wherein the heat transfer system 236 includes aheat sink that is attached to an internal structural member. As shown,the heat sink 360, which is disposed inside a casing 362, includes afirst surface 364 that is thermally attached to a chip 366 on a printedcircuit board 368, and a second surface 370 that is thermally attachedto a rib 372. The heat sink 360 is arranged to carry heat from the chip366 to the rib 372 so as to dissipate the heat via the surface area ofthe rib 372. The heat sink 360 is generally attached to the rib 372using conventional techniques. By way of example, the heat sinks may beattached to the rib by soldering, brazing or other similar attachmentmeans. In addition, the heat sink may be screwed or otherwise fastenedto the rib via a fastening device with thermal grease placedtherebetween.

Turning now to FIG. 9B, an alternative embodiment to the presentinvention is illustrated wherein the heat transfer system 236 includes aheat sink that is attached to an internal structural member via a heatpipe. As shown, the heat sink 374, which is disposed inside a casing376, is thermally attached to a chip 378 on a printed circuit board 380and thermally attached to a heat pipe 382. The heat sink 274 is arrangedto carry heat from the chip 378 to the heat pipe 382 and the heat pipe382 is arranged to carry heat from the heat sink 374 to a rib 384 so asto dissipate the heat via the surface area of the rib 384. The heat pipeis generally attached to the heat sink using conventional techniques. Byway of example, the heat pipe may be attached to the heat sink bysoldering, brazing or other similar attachment means. In addition, theheat pipe is generally attached to the rib using conventionaltechniques. By way of example, the heat pipe may be attached to the heatsink by soldering, brazing or other similar attachment means, as forexample, the heat pipe may be screwed or otherwise fastened to the ribvia a fastening device with thermal grease placed therebetween.

Turning now to FIG. 9C, an alternative embodiment to the presentinvention is illustrated wherein the heat transfer system 236 includes aheat sink that is integrated with an internal structural member. Asshown, the heat sink 386, which is disposed inside a casing 388, is aportion of a rib 390 that extends outwards towards a chip 392. Byextending the integrated heat sink 386 outwards, the rib-heat sink canbe thermally attached to the chip 392 on a printed circuit board 394.The rib-heat sink is arranged to carry heat from the chip 392therethrough so as to dissipate the heat via the surface area of the rib390.

While this invention has been described in terms of several preferredembodiments, there are alterations, permutations, and equivalents, whichfall within the scope of this invention. It should also be noted thatthere are many alternative ways of implementing the methods andapparatuses of the present invention. It is therefore intended that thefollowing appended claims be interpreted as including all suchalterations, permutations, and equivalents as fall within the truespirit and scope of the present invention.

1. A computing device, comprising: an outer housing adapted to containinternal operational components therein, the outer housing being formedfrom a thermally conductive material; an internal structure disposedinside the outer housing and configured to support the outer housing,the internal structure being formed from a thermally conductivematerial; one or more heat producing elements disposed inside the outerhousing; and a heat transfer system configured to facilitate thetransfer of heat generated at the one or more heat producing elementsinto both of the outer housing and the internal structure such that theheat is dissipated throughout the outer housing and the internalstructure, wherein the heat transfer system includes a heat sink that isthermally coupled to a heat producing element and a heat pipe that isthermally coupled to the heat sink and the outer housing, wherein theheat sink forms a thermal path between the heat producing element andthe internal structure, and wherein the heat pipe forms a thermal pathbetween the heat sink and the outer housing.
 2. The computing device ofclaim 1, wherein the internal structure comprises an internal chassis.3. A computing device, comprising: an outer housing adapted to containinternal operational components therein, the outer housing being formedfrom a thermally conductive material; an internal structure disposedinside the outer housing and configured to support the outer housing,the internal structure being formed from a thermally conductivematerial; one or more heat producing elements disposed inside the outerhousing; and a heat transfer system configured to facilitate thetransfer of heat generated at the one or more heat producing elementsinto both of the outer housing and the internal structure such that theheat is dissipated throughout the outer housing and the internalstructure, wherein the heat transfer system includes a plurality of heatsinks and a heat pipe, wherein at least a portion of the plurality ofheat sinks thermally couple at least a portion of the one or more heatproducing elements to the heat pipe, and wherein the heat pipe thermallycouples the at least a portion of heat sinks to the outer housing and isconfigured to transfer heat from the at least a portion of heat sinks tothe outer housing.
 4. The computing device of claim 3, wherein the heattransfer system further includes a fan positioned proximate the heatsinks and configured to send air across the heat sinks.
 5. A method ofdissipating heat in a computing device, comprising: thermally coupling afirst heat sink to a first heat producing element located within thecomputing device; placing a heat pipe between the first heat sink and ahousing of the computing device, the housing being formed from athermally conductive material, wherein the heat pipe thermally couplesthe first heat sink to the housing; positioning an internal structureproximate to the first heat sink, the internal structure being formedfrom a thermally conductive material and being disposed inside thehousing and configured to support the housing, wherein the first heatsink thermally couples the first heat producing element to the internalstructure; conducting heat from the first heat producing element to theinternal structure by way of the first heat sink such that heat isdissipated throughout the internal structure; and conducting heat fromthe first heat producing element to the housing by way of the first heatsink and the heat pipe such that heat is dissipated throughout thehousing.
 6. The method of claim 5, further including the steps of:thermally coupling a second heat sink to a second heat producing elementlocated within the computing device and separate from the first heatproducing element, wherein the second heat sink is arranged such thatthe heat pipe also thermally couples the second heat sink to the housingand such that the second heat sink thermally couples the second heatproducing element to the internal structure; conducting heat from thesecond heat producing element to the internal structure by way of thesecond heat sink such that heat is dissipated throughout the internalstructure; and conducting heat from the second heat producing element tothe housing by way of the second heat sink and the heat pipe such thatheat is dissipated throughout the housing.
 7. The method of claim 6,further including the steps of: placing a fan within the computingdevice and proximate to both the first and second heat sinks; andflowing cooling air from the fan across the first and second heat sinkssuch that heat is dissipated therefrom.
 8. The method of claim 7,wherein airflow from the fan is split into a plurality of air flowstreams within the computing device.
 9. The method of claim 5, whereinthe internal structure comprises an internal chassis defining aplurality of fins.
 10. A computing device, comprising: an outer housingadapted to contain internal operational components therein, the outerhousing being formed from a thermally conductive material; an internalstructure disposed inside the outer housing and configured to supportthe outer housing, the internal structure being formed from a thermallyconductive material; a plurality of heat producing elements disposedinside the outer housing; a plurality of heat sinks thermally coupled tothe plurality of heat producing elements and the internal structure, theplurality of heat sinks being adapted to transfer heat from theplurality of heat producing elements to the internal structure; and aheat pipe thermally coupled to each of the plurality of heat sinks andthe outer housing, the heat pipe being adapted to transfer heat from theplurality of heat sinks to the outer housing.
 11. The computing deviceof claim 10, wherein the outer housing is formed from titanium.
 12. Thecomputing device of claim 10, further including: an auxiliary componentformed from a thermally conductive material and disposed between theheat pipe and the outer housing, wherein the auxiliary componentthermally couples the heat pipe to the outer housing.
 13. The computingdevice of claim 10, wherein the plurality of heat sinks includes threeheat sinks, with each of the three heat sinks being thermally coupled toa separate heat producing element.
 14. The computing device of claim 10,wherein at least one of the plurality of heat sinks includes a surfacethat directly contacts the internal structure.
 15. A heat transfersystem configured to facilitate the dissipation of heat in a computingdevice, comprising: a first heat sink adapted to thermally couple to afirst heat producing element and an internal structure of a computingdevice such that heat is transferred from the first heat producingelement and dissipated throughout the internal structure; a second heatsink adapted to thermally couple to a second heat producing element andthe internal structure such that heat is transferred from the secondheat producing element and dissipated throughout the internal structure;and a primary heat pipe thermally coupled to both of the first andsecond heat sinks, wherein the primary heat pipe is adapted to thermallycouple to an outer housing of the computing device such that heat istransferred from both of the first and second heat sinks and dissipatedthroughout the outer housing.
 16. The heat transfer system of claim 15,wherein the first heat sink includes a surface that directly contactsthe internal structure.
 17. The heat transfer system of claim 15,wherein the first heat sink is thermally coupled to the internalstructure by way of a secondary heat pipe.
 18. The heat transfer systemof claim 15, wherein the first heat sink is integrally formed with theinternal structure.
 19. The heat transfer system of claim 15, furtherincluding: a third heat sink adapted to thermally couple to a third heatproducing element and the internal structure such that heat istransferred from the third heat producing element and dissipatedthroughout the internal structure, wherein the primary heat pipe is alsothermally coupled to the third heat sink such that heat is transferredfrom the third heat sink and dissipated throughout the outer housing.20. A computing device, comprising: an outer housing adapted to containinternal operational components therein, the outer housing being formedfrom a thermally conductive material; an internal structure disposedinside the outer housing and configured to support the outer housing,the internal structure being formed from a thermally conductivematerial; at least two heat producing elements disposed inside the outerhousing; and a heat transfer system configured to facilitate thedissipation of heat in the computing device, the heat transfer systemincluding: a first heat sink thermally coupled to the first heatproducing element and the internal structure such that heat istransferred from the first heat producing element and dissipatedthroughout the internal structure, a second heat sink thermally coupledto the second heat producing element and the internal structure suchthat heat is transferred from the first heat producing element anddissipated throughout the internal structure, and a primary heat pipethermally coupled to both of the first and second heat sinks and theouter housing such that heat is transferred from both of the first andsecond heat sinks and dissipated throughout the outer housing.
 21. Thecomputing device of claim 20, wherein the first heat sink includes asurface that directly contacts the internal structure.
 22. The computingdevice of claim 20, wherein the heat transfer system further includes: asecondary heat pipe that thermally couples the first heat sink to theinternal structure.
 23. The computing device of claim 20, wherein thefirst heat sink is integrally formed with the internal structure. 24.The computing device of claim 20, further including: an auxiliarycomponent formed from a thermally conductive material and disposedbetween the primary heat pipe and the outer housing, wherein theauxiliary component thermally couples the primary heat pipe to the outerhousing.